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Civil-Comp Proceedings
ISSN 1759-3433 CCP: 24
ADVANCES IN NON-LINEAR FINITE ELEMENT METHODS Edited by: B.H.V. Topping and M. Papadrakakis
Paper VII.10
Vibration of Bonded Plates C.C. Lin, R.C. Chu and T.C. Ko
College of Science, National Chung-Hsing University, Taichung, Taiwan C.C. Lin, R.C. Chu, T.C. Ko, "Vibration of Bonded Plates", in B.H.V. Topping, M. Papadrakakis, (Editors), "Advances in Non-Linear Finite Element Methods", Civil-Comp Press, Edinburgh, UK, pp 263-272, 1994. doi:10.4203/ccp.24.7.10
Abstract
An isoparametric adhesive interface element is used in the
vibration analysis of adhesively bonded structures. The
model assumes that transverse shear and peel stresses prevail
in the adhesive layer. The analyses articulate separate
responses of the upper and lower adherends and the
adhesive. The natural frequencies of bonded laminated
plates are found to agree well with the existing results
for plates having a similar geometries. The present element,
together with the 8-node isoparametric plate element
based on a first order shear deformation theory used
to model the upper and lower adherends, is found to be
effective in solving free vibration problems of adhesively
bonded laminated plates.
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