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Y. Aoues¹, A. Makhloufi¹, A. El-Hami¹ and P. Pougnet²

¹Laboratoire d'Optimisation et de Fiabilité en Mécanique des Structures, INSA Rouen-LOFIMS, Saint Etienne de Rouvray, France
²Valeo, France

doi:10.4203/ccp.106.139

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Y. Aoues, A. Makhloufi, A. El-Hami, P. Pougnet, "Global Sensitivity Analysis and Reliability-Based Design Optimization of Electronic Packages subject to Thermal Loading", in , (Editors), "Proceedings of the Twelfth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 139, 2014. doi:10.4203/ccp.106.139

Keywords: kriging metamodel, reliability, optimization, fatigue, solder joint..

Summary

Reliability is a major concern in the microelectronics industry. However, new packaging and assembly technologies and requirements to comply with environmental friendly directives create challenges in assuring the reliability of mechatronics products for higher performance and lower cost. Deterministic design modelling does not take into account the uncertainties of design parameters and the variability of operating conditions in service. In this paper, reliability-based design optimization (RBDO) is developed to search for the optimal geometrical configuration of the solder so that fatigue performances are better. Moreover, the RBDO formulation allows for dealing with uncertainties related to geometrical dimensions and temperature loading. The RBDO approach is combined with the kriging approximation in order to surrogate the thermo-mechanical nonlinear finite element model. This paper demonstrates the effectiveness of the RBDO method with the kriging metamodel to conduct the design optimization of complex structures.

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Front Page Browse CCP CSETS CTR IJRT Other Authors Search Purchase Guide FAQ Contact us	Civil-Comp Proceedings ISSN 1759-3433 CCP: 106 PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY Edited by: Paper 139 Global Sensitivity Analysis and Reliability-Based Design Optimization of Electronic Packages subject to Thermal Loading Y. Aoues¹, A. Makhloufi¹, A. El-Hami¹ and P. Pougnet² ¹Laboratoire d'Optimisation et de Fiabilité en Mécanique des Structures, INSA Rouen-LOFIMS, Saint Etienne de Rouvray, France ²Valeo, France doi:10.4203/ccp.106.139 purchase the full-text of this paper Full Bibliographic Reference for this paper Y. Aoues, A. Makhloufi, A. El-Hami, P. Pougnet, "Global Sensitivity Analysis and Reliability-Based Design Optimization of Electronic Packages subject to Thermal Loading", in , (Editors), "Proceedings of the Twelfth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 139, 2014. doi:10.4203/ccp.106.139 Keywords: kriging metamodel, reliability, optimization, fatigue, solder joint.. Summary Reliability is a major concern in the microelectronics industry. However, new packaging and assembly technologies and requirements to comply with environmental friendly directives create challenges in assuring the reliability of mechatronics products for higher performance and lower cost. Deterministic design modelling does not take into account the uncertainties of design parameters and the variability of operating conditions in service. In this paper, reliability-based design optimization (RBDO) is developed to search for the optimal geometrical configuration of the solder so that fatigue performances are better. Moreover, the RBDO formulation allows for dealing with uncertainties related to geometrical dimensions and temperature loading. The RBDO approach is combined with the kriging approximation in order to surrogate the thermo-mechanical nonlinear finite element model. This paper demonstrates the effectiveness of the RBDO method with the kriging metamodel to conduct the design optimization of complex structures. purchase the full-text of this paper (price £20) go to the previous paper go to the next paper return to the table of contents return to the book description purchase this book (price £65 +P&P)
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