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A. Makhloufi, Y. Aoues, A. El-Hami, "A Probabilistic Approach for the Reliability Assessment of Power Modules using Coupled Thermal-Mechanical Simulation", in , (Editors), "Proceedings of the Twelfth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 129, 2014. doi:10.4203/ccp.106.129

Keywords: power modules, probability, reliability, finite element, kriging..

Summary

This paper presents a numerical investigation of the probabilistic approach in estimating the reliability of wire bonding for microelectronic device structures. The finite element simulation model is used to analyze the sequence of the failure events in power microelectronic devices. This numerical model is used to estimate the probability of failure of power module regarding the wire bonding connection. However, as a result of the time-consuming methods of the multiphysics finite element simulation, a kriging metamodel is used as a surrogate for the response output of the limit state, in this way the reliability analysis is performed directly to the kriging approximation by using the FORM/SORM methods. This study demonstrates the appropriateness of using the reliability approach to predict the effects of the wire bonding failure of power modules.

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Front Page Browse CCP CSETS CTR IJRT Other Authors Search Purchase Guide FAQ Contact us	Civil-Comp Proceedings ISSN 1759-3433 CCP: 106 PROCEEDINGS OF THE TWELFTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY Edited by: Paper 129 A Probabilistic Approach for the Reliability Assessment of Power Modules using Coupled Thermal-Mechanical Simulation A. Makhloufi, Y. Aoues and A. El-Hami Laboratoire d'Optimisation et Fiabilité en Mécanique des Structures, INSA of Rouen, Saint Etienne-du-Rouvray, France doi:10.4203/ccp.106.129 purchase the full-text of this paper Full Bibliographic Reference for this paper A. Makhloufi, Y. Aoues, A. El-Hami, "A Probabilistic Approach for the Reliability Assessment of Power Modules using Coupled Thermal-Mechanical Simulation", in , (Editors), "Proceedings of the Twelfth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 129, 2014. doi:10.4203/ccp.106.129 Keywords: power modules, probability, reliability, finite element, kriging.. Summary This paper presents a numerical investigation of the probabilistic approach in estimating the reliability of wire bonding for microelectronic device structures. The finite element simulation model is used to analyze the sequence of the failure events in power microelectronic devices. This numerical model is used to estimate the probability of failure of power module regarding the wire bonding connection. However, as a result of the time-consuming methods of the multiphysics finite element simulation, a kriging metamodel is used as a surrogate for the response output of the limit state, in this way the reliability analysis is performed directly to the kriging approximation by using the FORM/SORM methods. This study demonstrates the appropriateness of using the reliability approach to predict the effects of the wire bonding failure of power modules. purchase the full-text of this paper (price £20) go to the previous paper go to the next paper return to the table of contents return to the book description purchase this book (price £65 +P&P)
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