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Keywords: flow-thermal coupled field analysis, parametric probabilistic sensitivity analysis, LTCC, thermal via array, LED lamp.

Summary

The aim of this paper was to investigate the robustness of reliability-based design for LED lamps. The random influence of the geometric characteristics in the thermal via array (TVA) of the LTCC substrate was investigated on the thermal performance and corresponding reliability of a 5 watt LED Lamp subject to the thermal limit of LED chips.

Firstly, the flow and thermal coupled field analysis of the high power LED lamp were implemented into the deterministic simulation of the numerical thermal calculation using the ANSYS^TM finite element code. It was demonstrated that the accurate thermal distribution calculation of the commercial high power blue-lighting LED lamps are investigated by the numerical simulation and experimental measurements.

Furthermore, to investigate the robustness of the reliability-based design for LED lamps, the probabilistic parametric sensitivity analysis (PPSA) of the high power LED lamp were proposed and constructed using an ANSYS^TM flow-thermal coupled numerical simulation and the stochastic mean-centered second order approximation (SMSOA). Firstly, in the probabilistic simulation of the stochastic quantitative effect of the TVA geometries on the junction temperature of the LEDs was studied by the proposed stochastic finite element method. Then, different types of the BRVs were performed to study the sensitivity of the parametric variation on the statistics of the thermal performance and the resulting reliability. Important factors among these design parameters that may significantly influence the variation of the thermal performance can be evaluated by these sensitivity factors. As shown in the simulation of the PPSA, certain BRV's variation may present the higher percentage of the variability on the LED thermal performance and the corresponding reliability. If these factors can be identified, they will be targeted for the aid of an efficient controlling over the robustness of the desired reliability.

By the demonstration of probabilistic numerical simulation, it can be seen that the proposed method is useful in identifying the contributors to the design of LTCC as LED heat dissipation substrates for progressing the robustness of the resulting reliability.

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Front Page Browse CCP CSETS CTR IJRT Other Authors Search Purchase Guide FAQ Contact us	Civil-Comp Proceedings ISSN 1759-3433 CCP: 88 PROCEEDINGS OF THE NINTH INTERNATIONAL CONFERENCE ON COMPUTATIONAL STRUCTURES TECHNOLOGY Edited by: B.H.V. Topping and M. Papadrakakis Paper 179 Probabilistic Parametric Analysis of the Thermal Conducting LTCC Substrate for an LED Lamp S.C. Lin¹, R.F. Huang², C.C. Lin³ and Y.T. Lin¹ ¹Institute of Mechanic and Electronic Engineering, National Formosa University, Taiwan ²Holy Stone Enterprise Co. Ltd., Taiwan ³Department of Mechanic and Automation Engineering, Dayeh University, Taiwan doi:10.4203/ccp.88.179 purchase the full-text of this paper Full Bibliographic Reference for this paper S.C. Lin, R.F. Huang, C.C. Lin, Y.T. Lin, "Probabilistic Parametric Analysis of the Thermal Conducting LTCC Substrate for an LED Lamp", in B.H.V. Topping, M. Papadrakakis, (Editors), "Proceedings of the Ninth International Conference on Computational Structures Technology", Civil-Comp Press, Stirlingshire, UK, Paper 179, 2008. doi:10.4203/ccp.88.179 Keywords: flow-thermal coupled field analysis, parametric probabilistic sensitivity analysis, LTCC, thermal via array, LED lamp. Summary The aim of this paper was to investigate the robustness of reliability-based design for LED lamps. The random influence of the geometric characteristics in the thermal via array (TVA) of the LTCC substrate was investigated on the thermal performance and corresponding reliability of a 5 watt LED Lamp subject to the thermal limit of LED chips. Firstly, the flow and thermal coupled field analysis of the high power LED lamp were implemented into the deterministic simulation of the numerical thermal calculation using the ANSYS^TM finite element code. It was demonstrated that the accurate thermal distribution calculation of the commercial high power blue-lighting LED lamps are investigated by the numerical simulation and experimental measurements. Furthermore, to investigate the robustness of the reliability-based design for LED lamps, the probabilistic parametric sensitivity analysis (PPSA) of the high power LED lamp were proposed and constructed using an ANSYS^TM flow-thermal coupled numerical simulation and the stochastic mean-centered second order approximation (SMSOA). Firstly, in the probabilistic simulation of the stochastic quantitative effect of the TVA geometries on the junction temperature of the LEDs was studied by the proposed stochastic finite element method. Then, different types of the BRVs were performed to study the sensitivity of the parametric variation on the statistics of the thermal performance and the resulting reliability. Important factors among these design parameters that may significantly influence the variation of the thermal performance can be evaluated by these sensitivity factors. As shown in the simulation of the PPSA, certain BRV's variation may present the higher percentage of the variability on the LED thermal performance and the corresponding reliability. If these factors can be identified, they will be targeted for the aid of an efficient controlling over the robustness of the desired reliability. By the demonstration of probabilistic numerical simulation, it can be seen that the proposed method is useful in identifying the contributors to the design of LTCC as LED heat dissipation substrates for progressing the robustness of the resulting reliability. purchase the full-text of this paper (price £20) go to the previous paper go to the next paper return to the table of contents return to the book description purchase this book (price £145 +P&P)
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