- Analysis of Stress Concentrations in Adhesively-Bonded Assemblies subject to Thermo-Mechanical Loads: Application to the Characterisation of the Adhesive Behaviour,
J.Y. Cognard, C. Badulescu, N. Carrère, R. Créac'hcadec and P. Védrine
Paper 9.142 from CCP: 99, ISBN 978-1-905088-54-6 (2012)
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